NAME: Ronald B. Azcarate
Texas Instruments (Phils.) Inc.,
PEZA, Loakan Rd., Baguio City
Phone: (63-74) 442-5681 loc 2301
e-mail: r-azcarate@ti.com
Residence:
123 Loakan Rd., 2600 Baguio City
phone : (63-74) 447-3761
e-mail : ronaldazcarate@yahoo.com
Employment
==========
1991-Present
Texas Instruments (Phils.) Inc.,
PEZA, Loakan Rd., Baguio City
Work Experience:
================
December 1998
-------------
- Elected MEMBER GROUP TECHNICAL STAFF (MGTS)
August 1998 - Present
---------------------
Assy Operations Process Engineering - Section Manager
Directly reports to Assy operations Engineering Manager. Plan, organize,
coordinate and manages Assembly backend operations through People Management,
Equipment and Yield Management and Cost Management. Prioritizing them in
accordance to what would give the best impact to total company goals. Mentoring
Engineers in technical activities related to package assembly, reliability,
productivity and cost.
June 1997- August 1998
----------------------
New Package Dev’t Engineering – Senior Packaging Engineer
Overall project manager for microstarBGA (CSP FlexBGA)
Substrate design Engineer for microstarBGA in TIPI and member of
TI WW microstarBGA substrate design group.
following packages developed for TIPI
(comprises 95% of TIPI BGA volume):
12x12 package including all pin types (100, 128, 144, 180)
11x11 package (100pins)
15x15 package including all derivative pin types (196,176)
10x10 package (80pins)
8x8 package (64pins)
WEB Master for TIPI NPD group
October 1995-May 1997
---------------------
New Package Dev’t Engineering - Packaging Engineer
In charge of new package design and qualification, involved in new package
manufacturing readiness, process characterization, new technology research and
development that pertain to packaging, which includes patent disclosures.
following packages developed for TIPI:
80lds 12x12x1.0 Thin QUAD flat package L1 package
240lds 32x32x3.8 Thermally enhanced package for 16mm chip size.
128lds 28x28x3.8 standard QUAD flat package
September 1994-October 1995
---------------------------
Assy Operations Finish Engineering - Symbol Process Supervisor
In charge of the Finish symbol process engineers and guide/directs them in yield
improvement, process cost reduction, process flow simplification, customer
marking requirement for PDIP, PLCC, QFP. And directly reports to the finish
module manager.
January 1994-September 1994
---------------------------
QFP Finish Engineering Symbol Process Breakthrough
Mainly deals with marking process operation using Shinkawa Direct printing
machines, Markem U-1990 pad printing machines. In charge of whole QFP symbol
process operation mainly dealing with symbol specifications, process flow
simplification and monitoring of symbol performance in terms of over-all symbol
operation yield, cost, productivity.
August 1993-December 1993
-------------------------
QFP Finish Engineering Trim & Form / Symbol Equipment Breakthrough.
Mainly deals with Equipment used in trim and form as well as marking such as
Santec Trim system, Santec Form system, Towa Trim and form system, and Marking
machines as stated above. In charge of Implementing Preventive maintenance for
the mentioned eqiupments, Studies to improve machine performance and efficiency.
June 1992-July 1993
-------------------
QFP Finish Engineering - Trim & Form / Symbol / Mold
Sustaining support / Shift facilitator.
Provides Day to Day support to manufacturing in meeting daily productivity
requirements by overseeing operation within the shift as well as providing
maintenance support for equipment used in the finish area
Aug 1991-May 1992
-----------------
Mechanization Group / Design and Development
Design Cadet Engineer
Conceptualizes/evaluates ideas for machine performance improvement and design
such projects. Works on research and development for machine/equipment upgrades,
innovation and quality and productivity improvement at minimum cost.
Assists in the installation and set-up of projects in the production line.
Monitors and evaluates the performance of projects. Interfaces with concerned
personnel of other areas relative to project development and status.
Education
========
1986-1991 COLLEGE Saint Louis University
College of Engineering and Architecture
Baguio City
Bachelor of Science in Mechanical Engineering
1982-1986 HIGH SCHOOL University of the Philippines College Baguio
Baguio City
Personal Background
===================
- born September 21, 1969 at San Pablo City, Laguna
- well verse in English and Pilipino
- Knowledgeable in HTML authoring.
- Well versed with numerous computer application software.
- Ability to use effectively Engineering Measuring tools.
Technical Papers:
=================
- MicrostarBGA Packaging critical interconnect: wirebond and solderjoint
- Presented SEMICON WEST 98, California USA (co-author)
- Implementing finepitch design for CSP flexible circuit substrate
- presented TIPI technical symposium '98
- Laser Marking on metal stiffeners
- published TIPI technical symposium '98
- Solderball on board reliability modeling for microstarBGA
- presented TIPI technical symposium '97
- presented TI Asia technical symposium (MALAYSIA)’97
- presented ASEMEP technical symposium '98
- Package voiding solution on TQFP encapsulation
- presented TIPI technical symposium ’96
- presented TI Asia technical symposium (TAIWAN) ’96
- presented ASEMEP technical symposium ‘97
- Graphite: solution to <1.0mm char ht on ink marking
- published TIPI technical symposium ’96
Training:
Off-shore Training/Seminars
===========================
- Flex tape substrate design for finepitchBGAs TI Japan Oct 97
- 3M Technical exhibition (Flextape) 3M Singapore Nov 97
- Substrate Manufacturing Orientation/Training Shindo Japan Aug 97
- MicrostarBGA operation star-up training TI Japan July 97
- Markem U-1990 Auto Marking Machine Training Markem USA July 94
- Markem 612 Platemaker Markem USA July 94
- New Hermes Engravers New Hermes USA July 94
- Rubber stamp making technology Plano graphics USA July 94
- Shinkawa SIM-DP1 Automarking eqpt Training Shinkawa Japan July 93
- Santec Trim/Form systems Training Santec Japan July 93
- Santec Standard Tooling design Training Santec Japan July 93
- Idec Hydrogen-Oxygen gas generator Training Idec Japan July 93
Recent Onsite Trainings (3 years history)
=========================================
Acceptance sampling July 98
PC Hardware Training June 98
Encapsulation and Mold compound Training May 98
Wirebonding and Goldwire Training (by K&S) Apr 98
Bond of Active Circuit/ESD Orientation (by DMOS4) Feb 98
Package Moisture sensitivity Level Training Nov 97
Semiconductor Packaging Trends Seminar June 97
Ball Attach on KME-10CS (by KME) May 97
FMEA Applications training (by Ford) Apr 97
PRO Engineering for beginners (by Parametric) Feb 97
Leadership training Feb 97
SPC Level 1 Dec 96
Basics of HTML Aug 96
Waferfab Orientation (by DMOS5) June 96
Package reliability and Failure Analysis (by DSPS pkgg) May 96
Material Science (by Dr.Mena) May 96
Basic Radiation safety (by Dept of Health) Mar 96
Laser Marking on POQ-150 (by Komatsu) Mar 96
BGA Packaging Trends Seminar (by DSPS pkgg) Feb 96
Technical report writing Jan 96
Leadframe Manufacturing Training (by EPD) Nov 95
DSP Solutions awareness Training Sep 95
Other Trainings attended
========================
ESD/Cleanroom orientation Annually
Basics of Supervision Jan 93
Metrology workshop MaR 92
JIPM/TPM Orientations Annually
ISO9000 Orientations Annually
Character Reference: Available upon request