Chan Wai Can

wcchan@mtu.edu

340, JLN Merdeka,
KG. Ampang, 68000 Selangor, Malaysia
KL: (03) 492-1698
Penang: (012) 433-5430
OBJECTIVE To gain a full time Metallurgical/Materials/Process/Development Engineering position in fields related to Microstructure Analysis, Surface Analysis, Electron Microscopy, High-Resolution Digital Imaging, Research and Development, and Product Design in a leading materials manufacturing firm.

EDUCATION Michigan Technological University, Houghton, MI 49931
MASTER OF SCIENCE IN MATERIALS ENGINEERING, Spring' 99
  • Research: Phase Equilibria and Reaction Kinetics of Compound Semiconductor Materials
  • GPA: 3.65 / 4.00

    Michigan Technological University, Houghton, MI 49931
    BACHELOR OF SCIENCE IN PHYSICS, Spring'96
  • GPA: 3.90 / 4.00

    • RELEVANT EXPERIENCE Michigan Technological University, Houghton, MI 49931
    GRADUATE RESEARCH ASSISTANT AND M.S. CANDIDATE, 9/96-4/99
    Department of Metallurgical and Materials Engineering

    Thesis work: "Contact Metallization of Nickel with Gallium Phosphide (GaP), a Group III-V Novel Compound Semiconductor"

    • To improve metal (Ni) - semiconductor (GaP) electrical contacts through chemistry, thermodynamics and phase diagram modeling, and diffusion and solid-state reaction kinetics
    • To develop utile electrical contacts by selecting a promising metallization layer formed by GaP and Nickel after reaction takes place at high temperature (T > 300 C)
    • To utilize Scanning Electron Microscopy (SEM) to study the morphology of the various phases formed by bulk Ni-Ga-P at various temperature (300, 400, 500, and 700 C)
    • To apply both Electron Probe Micro-Analyzer (EMPA) and X-ray Diffraction Technique (XRD) to measure the crystal structures and lattice parameters of the bulk Ni-Ga-P samples
    • To use the both Transmission Electron Microscopy (TEM) and Auger Electron Spectroscopy (AES) to characterize the reaction products formed by the thin-film reaction between Ni and (100) GaP

    TECHNICAL SKILLS
  • Scanning Electron Microscopy (SEM)
  • Electron Probe Micro-Analyzer (EPMA)
  • Transmission Electron Microscopy (TEM)
  • X-ray Fluorescence Analyzer
  • Auger Electron Spectroscopy (AES)
  • X-ray Diffractometer
  • Optical Microscope
  • Metallography
  • Duo Ion Mill
  • Automated Dimple Grinder and Polisher
  • Ultrasonic Disc Cutter
  • Automated Wheel Sander and Polisher
  • Dark room operation

    • UNDERGRADUATE RESEARCH PROJECT Senior Research Project for Physics, 10/95-5/96

    Project title: "Molecular Dynamics Study of Random Alloys"

    • To investigate the effects of relativesize of atoms on the crystal structure, lattice parameters, and elastics properties by using molecular dynamics computer simulation
    • To simulate a computer model for copper-platinum random alloy with finite size
    • To equilibrate the simulated system at constant volume and the elastic constants

    COMPUTER SKILLS
  • Software: MathCad, Fortran, Temple Graph, SigmaPlot, and PhotoShop
  • Operating systems: WINDOWS 98, DOS, and UNIX

    • PROFESSIONAL ORGANIZATIONS
  • Member of the American Society for Materials (ASM International)
  • Member of the Alpha Sigma Mu Honor Society
  • Member of the Sigma Pi Sigma Physics Honor Society
    		•

    ACTIVITIES Departmental Representative of Metallurgical Department (1997-present)
    Graduate Student Council, MTU

    Treasurer (1997-1998)
    Malaysian Student Association, MTU

    HONORS
  • Dean's List from Inti College, Malaysia (1993-1994)
  • Merit Certificate in Mathematics from MTU (1995)
  • Summa Cum Laude Honor Degree from MTU (1996)
    		•

    AVAILABILITY August, 1999

    REFERENCES Available upon request
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